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LoneWolf

HP Microserver Gen8 Processor FAQ

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VINNIEINC

Hi,

 

Please could you tell me if the E3-1270 V2 CPU is an option?

 

Thanks

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LoneWolf

Hi,

 

Please could you tell me if the E3-1270 V2 CPU is an option?

 

Thanks

 

It will likely work.  However, as mentioned before, I don't advocate 69w TDP processors in the Microserver Gen8.  You're much better off with a 45w TDP processor; the passive heatsink is only designed for 35w TDP processors.

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Conneckter

Hey Everyone,

 

yesterday I upgraded my two HP Microserver Gen8 with a i3-3220T and a Xeon E3-1220L V2 and it works great!

 

 

 

2014_07_10_Kiefersfelden_Server_Umbau_00

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tangcla

I've just won an auction for a Xeon 1260L.

What have previous upgraders' experience been with needing to lap the heatsink?

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Joe_Miner

You can test the Heat-sink face to see how flat it is -- if it's bowed in or out you may find it worthwhile to lap it but lapping can be a serious PIA.

 

http://homeservershow.com/hp-proliant-gen8-microserver-lapping-cpu-heat-sink.html

 

It does make a difference but you may find the need to add fans to the Heat sink or increase the BIOS fan setting to Increased cooling -- or both if your OCD like me.

 

Edited by Joe_Miner
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tangcla

It does make a difference but you may find the need to add fans to the Heat sink or increase the BIOS fan setting to Increased cooling -- or both if your OCD like me.

Did the small fan increase noise noticeably?

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LoneWolf

I've just won an auction for a Xeon 1260L.

What have previous upgraders' experience been with needing to lap the heatsink?

 

stix01 has the 1260L.  I don't think he's lapped his heatsink.

 

The 1260L should be one of the cooler running quad-cores due to the heatspreader being attached with fluxless solder to the CPU die.  In comparison, the newer 1265L v2 which I am running probably would run warmer under load, even though it's a lower-micron process, due to Intel switching to thermal interface material between the spreader and die.

 

I have never lapped my HP heatsink.  If the surface of yours is even, there shouldn't be a need, especially if you use quality thermal compound, such as those available from Noctua or Thermalright.

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tangcla

stix01 has the 1260L.  I don't think he's lapped his heatsink.

 

The 1260L should be one of the cooler running quad-cores due to the heatspreader being attached with fluxless solder to the CPU die.  In comparison, the newer 1265L v2 which I am running probably would run warmer under load, even though it's a lower-micron process, due to Intel switching to thermal interface material between the spreader and die.

 

I have never lapped my HP heatsink.  If the surface of yours is even, there shouldn't be a need, especially if you use quality thermal compound, such as those available from Noctua or Thermalright.

Thanks - Noctua AT1, check ;)

 

Will see how flat the surface is before I bust out the sandpaper. I've never lapped before, but I have sanded before. The process doesn't look too difficult... It can't do any real harm, right, as long as I keep the sanding surface flat, and I rinse the heatsink very well to remove all metal filaments?

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Joe_Miner

The Evercool's aren't that loud.

 

Lapping isn't that difficult if you take your time and don't try to hurry it -- but it's probably not worth the effort if your heat-sink face is flat already.  You can look at my pictures -- mine was definitely warped so it needed Lapping.

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ikon

It can't do any real harm, right

 

Yes it can. If not done properly, you can actually make things worse. Patience and consistency of technique are key.

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