Intel will debut their new 2nd Generation Core microprocessor code named Sandy Bridge CPU at CES on January 5th, 2011. While UWHS and BYOB will be at CES 2011, and reporting on the official release, check out this short read ahead of time on the pre-release specs of this new 1155 H67 CPU socket.
Sandy Bridge is not just a place in Singapore my friends. This new CPU will knock your socks off and these new 2nd Generation Core processors are sure to impress.
Lets see what the new Sandy Bridge CPU has to offer.
Intel CPU Data
This was announced back in September but concrete details prior to CES are still hard to find. From what we can tell the Sandy Bridge is:
- Eventual successor to the Nehalem series in a new 1155 socket AKA H67 Chipset.
- 32-nanometer microarchitecture like the Arrandale and Clarkdale CPUs. Arrandale being the mobile Core i3, i5 and i7 while Clarkdale is the Core i3-5 series and Core i5-6 series.
- Clocked at 2.3 to 3.4 GHz with boosts to 3.8 GHz.
- The processor has a built in graphics engine that that shares the cache that should increase efficiency and use less power ranging from 18-55 for mobile and 35-95 for desktop systems.
- The processor handles HD content as well as 3-D and should be good for mainstream gaming.
- New version of Intel's Turbo Boost Technology (reallocation of processor cores).
- Sandy Bridge chips utilize the 256-bit AVX and the OS support is limited to Windows 7 and Server 2008.
- Intel and AMD agreed on this new architecture and AMD has codenamed theirs the Bulldozer line that uses the brand new K10 series.
Some additional points of interest or possible issues:
- Some L3 cache on chips will be disabled to segment the market.
- Dual and Quads available at launch with six and eights coming later.
- Overclocking will be limited since modifying the base clock out of spec will cause problems in hardware. Intel will offer a special processor with a “K” notation that has an unlocked multiplier that ZDNet says can do 4.9 GHz with air cooling.
ATX board GA-P67A-UD7
- Dual Channel DDR3 up to 16GB
- Dual Gigabit that supports teaming and Smart Dual LAN
- 2 PCI-E x16 and 2 PCI-E x8 (shared)
- 2 SATA 6Gb/s, 4 SATA 3Gb/s with RAID support.
- Chipset supports up to 10 USB 3.0 ports with 6 on back and 4 on headers.
See you at CES 2011.
Additional Resources and Links